MediaTek has been on a roll lately – following the launch of its latest Dimensity 9300 mobile chipset and new additions to its networking framework hardware, the Taiwanese giant recently announced the official launch of its new Dimensity 8300 chip, which follows in the footsteps of its more premium sibling. MediaTek says that the Dimensity 8300 is focused on giving users power efficiency without skimping on AI capabilities, adaptive gaming technology, as well as flagship-level experiences for midrange devices.
Developed with TSMC’s second-generation 4nm process, the Dimensity 8300 features an octa-core CPU with four Arm Cortex-A715 cores, and four Cortex-A510 cores built on Arm’s latest v9 CPU architecture. MediaTek adds that the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency versus previous generations. Furthermore, the Dimensity 8300’s Mali-G615 MC6 GPU upgrade provides up to 60% greater performance and 55% better power efficiency. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit comments:
“With MediaTek’s optimized Dimensity 8000 series, consumers don’t have to pick and choose between accessibility and premier experiences like flagship-grade memory or accelerated AI capabilities—they can have it all. The Dimensity 8300 unlocks new possibilities for the premium smartphone segment, offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity without sacrificing efficiency.”
Other features of the 8300 include:
- LP5x 8533Mbps and uFS4.0 MCQ memory provide a 33% speed boost on LPDDR and up to 100% faster R/W to flash compared to Dimensity 8300’s predecessor.
- MediaTek 5G UltraSave 3.0+ improves 5G power efficiency by up to 20% in daily usage scenarios compared to the previous generation.
- Upgraded Wi-Fi 6E performance with 160 MHz bandwidth, plus Wi-Fi/Bluetooth hybrid coexistence technology so earbuds, wireless gamepads, and other peripherals work together seamlessly.
- Dimensity 5G Open Resource Architecture (DORA), allows device makers to create unmatched smartphones that stand out in unique ways amongst competitors.
As for AI, MediaTek claims that the Dimensity 8300 is the first premium-tier SoC with full generative Ai support, which is made possible with the APU 780 AI processor baked within the chip. With this, the 8300 is able to support large language models (LLMs) and even stable diffusion. For photography, MediaTek’s 14-bit HDR-ISP Imagiq 980 takes charge, allowing support for 4K 60fps videos with HDR resolution.
For battery performance during intensive tasks, MediaTek has brought over its HyperEngine adaptive game technology, which the company says can provide users with advanced power savings even with demanding tasks. With this, the Dimensity 8300 can keep a user’s device cool, with consistent FPS, reduced lag, and seamless rendering.
In terms of availability, MediaTek says that the Dimensity 8300 will be available in 5G devices before the end of 2023. No specific manufacturers were mentioned, however, although we can expect the usual list of partner OEMs to be in the spotlight once the 8300 makes its debut.