MediaTek recently announced its latest addition to its Dimensity range of smartphone chips with the new Dimensity 9400e, which features an “All Big Core” that’s designed for high-end smartphone models. According to the company, the Dimensity 9400e is designed to provide a wider array of choices and functionality for smartphone manufacturers.
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Built on TSMC’s third-generation 4nm process, the Dimensity 9400e comes with four high-performance Cortex-X4 super cores clocked at up to 3.4GHz and four Cortex-A720 big cores running at 2.0GHz. Graphics duties are handled by a flagship 12-core Immortalis-G720 GPU, with support for hardware-level mobile ray tracing technology, something that we’ve seen more of on recent smartphone chips from MediaTek and rivals like Qualcomm.
For gaming, the Dimensity 9400e comes with MediaTek’s HyperEngine technology and supports MediaTek Adaptive Gaming Technology (MAGT 2.0), which enables real-time performance scheduling between the chipset and gaming applications for improved frame rate stability and reduced power consumption. Additionally, MediaTek Frame Rate Converter (MFRC 2.0+) support is included, which the company claims can reduce power consumption by up to 40% when enabled.
Unsurprisingly, MediaTek also places emphasis on AI via the Dimensity 9400e’s support for the latest MediaTek NeuroPilot SDK. The chipset features enhanced inference decoding technology (SpD+), which on paper is designed to accelerate computational efficiency of large language models. There’s also support for a wide range of global mainstream large language models and small language models, including on-device operation of models like DeepSeek-R1-Distill, Qwen1.5B/Llama7B/Llama8B, as well as Gemini Nano with Multimodality and LLaVA-1.5 7B.
Beyond its core processing and AI capabilities, the MediaTek Dimensity 9400e mobile chipset also comes with an extended Bluetooth connection range of up to 5km between phones within line of sight, support for sub-6GHz four-carrier aggregation (4CC-CA) for peak network download speeds of up to 7Gbps, Wi-Fi 7 tri-band concurrency (5 data streams) with peak transmission speeds at up to 7.3Gbps, MediaTek’s 5G UltraSave 3.0 power-saving technology for enhanced battery life, and multi-mode dual-SIM dual-active functionality.
For photography, the Dimensity 9400e packs a flagship 18-bit RAW ISP with support for AI semantic segmentation video engines for 16-layer image segmentation. For audio, there’s support for up to three microphones with high-dynamic noise reduction. MediaTek states that the first smartphones powered by the Dimensity 9400e mobile chipset are expected to hit the market starting this month.
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Additionally, MediaTek also announced its third-generation T930 chipset for 5G Fixed Wireless Access (FWA) and mobile Wi-Fi (Mi-Fi) devices, which runs on a 4nm design with support for sub-6GHz bands and 10Gbps 5G speeds. The T930 comes with 6CC-CA downlink, 5-layer 3Tx with up to 2.8Gbps uplink, and 8Rx with 200MHz DL bandwidth. Also present is support for 3GPP Release-18 and MediaTek’s M90 5G modem, a quad-core Arm Cortex-A55 CPU, and a dedicated network processor for 5G to Wi-Fi/Ethernet throughput.
