Not too long after launching its new and all-powerful Dimensity 9300 mobile SoC, MediaTek once again took to the stage to herald the arrival of its Filogic 860 and Filogic 360, its newest additions to its Wifi 7 hardware portfolio. MediaTek hopes that its new tech will further expand and build on the company’s existing Wifi hardware platform, balancing performance and reliability when most needed.
The continued adoption of Wifi 7 has shown that there’s a definite need for manufacturers to offer newer hardware solutions that incorporate enhanced compatibility for the best possible performance and connectivity. Alan Hsu, MediaTek VP and GM for Intelligent Connectivity Business states:
“MediaTek stands out with the most comprehensive connectivity portfolio on the market, and we’re continuing this legacy with our two new advanced Wi-Fi 7 solutions designed for mainstream applications. Filogic 860 and Filogic 360 offers the same technology as our premium solutions with exceptional reliability in busy network environments, ultra-fast speeds with reduced latency and enhanced range.”
MediaTek Filogic 860
- Industry-leading 6nm low-power Wi-Fi design
- Single-MAC MLO support
- Supports 4096-QAM and MRU
- Supports dual-band Wi-Fi 7 with industry-highest dual-band MLO speed, 7.2Gbps
- Dual-band, dual concurrent capabilities with 4T4R for 2.4GHz up to BW40 and 5T5R 4SS for 5GHz up to BW160
- Support for an additional receive antenna for zero-wait DFS
- Filogic Xtra range support, boosting receiving distance using an extra antenna
With the Filogic 860, MediaTek has combined a Wi-Fi 7 dual-band access point with its new and advanced network processor solution, designed for large-scale operations that require massive network connectivity. This makes it ideal for enterprise access points, service provider Ethernet gateways and mesh nodes, as well as retail and IoT router applications. MediaTek has designed the 860 while building on the success of its first-generation design, equipping it with a triple-core Arm Cortex-A73 CPU. This allows support for powerful hardware acceleration for advanced tunneling and security features for enterprise, service provider requirements.
MediaTek Filogic 360
- Triple-band selectable Wi-Fi 7 2×2 with up to 2.9Gbps speed
- Supports 4096-QAM and MRU
- 160MHz channel bandwidth support
- Filogic Xtra range support, boosting communication distance by unique Hybrid MLO solution
- Support for dual Bluetooth 5.4 cores for gaming and other applications
- BLE audio with integrated DSP for LC3 codec support
- MediaTek’s advanced Wi-Fi and Bluetooth coexistence technology ensures both technologies can operate on the 2.4 GHz band seamlessly, without interference.
Meanwhile, the Filogic 360 is a stand-alone, single chip that’s more suited for individual and private use. The chip features Wi-Fi 7 2×2 and dual Bluetooth 5.4 connectivity, which MediaTek says is designed to deliver best-in-class connectivity for high-performance clients such as smartphones, PCs, laptops, set-top boxes, OTT streaming, and many other devices.
In terms of availability, it shouldn’t be too long before we see MediaTek’s new chips in action. The company says that the Filogic 860 and Filogic 360 have begun sampling for customers, with mass production anticipated for mid-2024.